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Positron spectroscopy of high-k dielectric films on SiC

Lookup NU author(s): Dr Rajat Mahapatra, Professor Nick Wright

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Abstract

A correlation has been observed between the structural integrity and growth temperature of ∼ 80 nm-thick TiO2 films grown on SiO 2/4H-SiC substrates as high-k dielectric stacks for power device applications, using variable-energy positron annihilation spectroscopy. The structural change, tentatively attributed to a decrease in oxygen vacancy concentration, was observed as the TiO2 growth temperature was increased in the range 700 to 1000 °C, whereas grain boundaries form in the polycrystalline material grown at the highest temperatures. It is proposed that the optimal electrical performance for films grown at 800 °C reflects a balance between decreasing vacancy concentration and increasing grain boundary formation. Because positrons are swept to the SiO2/SiC interface by a field in the substrate, VEPAS is strongly sensitive to interface states, which can have important consequences for channel mobility and thus the electrical performance of the devices. The use of a number of lineshape parameters (beyond the standard S and W) has been applied to these measurements, enabling clearer insights to be gained. © 2007 WILEY-VCH Verlag GmbH & Co. KGaA.


Publication metadata

Author(s): Coleman PG, Burrows CP, Mahapatra R, Wright NG

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Published

Conference Name: Physica Status Solidi C: Current Topics in Solid State Physics. 14th International Conference on Positron Annihilation (ICPA 14)

Year of Conference: 2007

Pages: 3668-3671

ISSN: 1862-6351

Publisher: Wiley-Blackwell

URL: http://dx.doi.org/10.1002/pssc.200675787

DOI: 10.1002/pssc.200675787


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