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Lookup NU author(s): Ryan McGlen, Professor Jonathan LeeORCiD
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Increased processing speed, miniaturisation and higher packing densities of electronic processing chips has lead to the development of high power, high heat flux electronics cards used by the telecom and server industries to process digital signals. The drive towards higher system performance has put a large demand on forced air convection cooling techniques and is heading towards the thermal limit of the technology. Thermal management is becoming the limiting factor in the development of higher power electronic devices. To meet future heat transfer demands, innovative methods of thermally managing electronic devices are required. This paper looks at the creation of a test facility and single phase, prototype micro-channel heat exchanger design to cool high power silicon and optical chips. Copyright © 2005 by ASME.
Author(s): McGlen RJ, Lee J, Buffone C
Publication type: Conference Proceedings (inc. Abstract)
Publication status: Published
Conference Name: Proceedings of the 3rd International Conference on Microchannels and Minichannels, 2005
Year of Conference: 2005
Pages: 209-214
Publisher: American Society of Mechanical Engineers
Library holdings: Search Newcastle University Library for this item
ISBN: 9780791841853
