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Lookup NU author(s): Dr Othman AlmusaimiORCiD
This work is licensed under a Creative Commons Attribution 4.0 International License (CC BY 4.0).
Diethylene glycol dimethacrylate (DEG)-crosslinked polystyrene (PS) resin offers a promising alternative to traditional divinyl benzene (DVB)-PS resin for solid-phase peptide synthesis (SPPS), particularly for challenging sequences with hydrophobic or bulky amino acids. DEG-PS resin's reduced hydrophobicity and enhanced flexibility improve synthesis efficiency, yielding peptides up to 28 residues with higher purities and yields compared to DVB-PS. In various syntheses, DEG-PS outperformed DVB-PS resin, with higher purities and yields for challenging peptides such as ABC analogue (73.2%, 58.3% vs. 72.5%, 46.3%) and Thymosin (58.4%, 48.6% vs. 54.0%, 39.2%). In addition, DEG-PS resin effectively suppressed common side reactions, such as dipeptide formation, typically encountered with Wang PS-based resins. Incorporating green chemistry principles, DEG-PS enabled the synthesis of complex peptides with satisfactory results using environmentally friendly solvents and reagents. Three challenging peptides; β (34–42), Jung and Redemann (JR), and ABRF 1992–were synthesized on DEG-PS resin, achieving purities of 41.4%, 41.0%, and 68.0%, and yields of 50.5%, 52.6%, and 56.2%, respectively. These findings highlight DEG-PS resin's advantages for classical, green, and automated SPPS, offering superior performance and scalability for industrial applications.
Author(s): Al Musaimi O, Tomkins J, Barry SM, Basso A, Kou X, Zhang C, Serban S
Publication type: Article
Publication status: Published
Journal: RSC Advances
Year: 2024
Volume: 54
Online publication date: 23/12/2024
Acceptance date: 06/12/2024
Date deposited: 07/01/2025
ISSN (electronic): 2046-2069
Publisher: Royal Society of Chemistry
URL: https://doi.org/10.1039/D4RA07484J
DOI: 10.1039/D4RA07484J
Data Access Statement: The authors confirm that the data supporting the findings of this study are available within the article and its ESI.
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