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Lookup NU author(s): Mohammed Al-DalooORCiD, Professor Alex Yakovlev
This is the authors' accepted manuscript of an article that has been published in its final definitive form by IEEE, 2019.
For re-use rights please refer to the publisher's terms and conditions.
Nowadays, the interconnect circuits’ conduct playsa crucial role in determining the performance of the CMOSsystems, especially those related to nano-scale technology. Modellingthe effect of such an influential component has been widelystudied from many perspectives. In this work, we proposed anew general formula for RLC interconnect circuit model inCMOS technology using fractional-order elements approach. Thestudy is based on approximating an infinite transfer functionof the CMOS circuit with a non-integer distributed RLC loadto a finite number of poles. It is accurate due to the effect ofadding fractional-order variables and since these variables areutilised for tuning the model to match the design regardless of itscomplexity. As such, Delay calculations employing our analyticalmodel are within 0.4 absolute error of COMSOL-computeddelay across a range of interconnect lengths. Furthermore, theeffect of the interconnect conductivity G has been taken intoaccount tacitly although the model included the resistance R,inductance L and capacitance C of the interconnect. A numberof analyses were set up at different levels of the design to evaluatethe effectiveness. First, demonstrating the significant effects ofgeneralising parameters was gained by studying the fractionalorderimpedance and propagation constant of the transmissionline for a range of frequencies. Second, using MATLAB weassessed the potential of the proposed approximated modelbesides the exact one, which shows similarity in the fundamentalfeatures of the system such as stability and resonance. Third,the proposed approach showed that with a very small tuningreach 0.01 of the generalising parameters can achieve up to 15%improvement in the model accuracy.
Author(s): Al-Daloo M, Soltan A, Yakovlev A
Publication type: Article
Publication status: Published
Journal: IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems
Year: 2019
Volume: 39
Issue: 10
Pages: 2722-2734
Print publication date: 01/10/2020
Online publication date: 27/12/2019
Acceptance date: 20/11/2019
Date deposited: 29/12/2019
ISSN (print): 0278-0070
ISSN (electronic): 1937-4151
Publisher: IEEE
URL: https://doi.org/10.1109/TCAD.2019.2962779
DOI: 10.1109/TCAD.2019.2962779
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