Overview study of on-chip interconnect modelling approaches and its trend

Al-daloo, M; Soltan, A; Yakovlev, A

doi:10.1109/MOCAST.2018.8376647

Overview study of on-chip interconnect modelling approaches and its trend

Lookup NU author(s): Mohammed Al-Daloo ORCiD, Professor Alex Yakovlev

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Abstract

© 2018 IEEE. Several techniques related to the interconnect structure analysing and the modelling were outlined. Emphasis has been placed on modelling approach, starting from a one-dimensional and simple lumped issue and stretching to be a more general three-dimensional nonuniform problem. In addition, the advantages and disadvantages of each approach have highlighted to state the importance of these models for further research and their prospects. That verified through studying the approaches principles and an uncomplicated comparison.