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Thermal Pattern Contrast Diagnostic of Micro Cracks with Induction Thermography for Aircraft Braking Components

Lookup NU author(s): Dr Bin Gao, Dr Wai Lok Woo, Professor Gui Yun TianORCiD

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This is the authors' accepted manuscript of an article that has been published in its final definitive form by IEEE, 2018.

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Abstract

IEEE Reciprocating impact load leads to plastic deformation on the surface of the kinematic chains in aircraft brake system. As a result, this causes fatigue and various complex natural damages. Due to the complex surface conditions and the coexistence damages, it is extremely difficult to diagnose micro cracks by using conventional thermography inspection methods. In this paper, the Thermal Pattern Contrast (TPC) method is proposed for weak thermal signal detection using eddy current pulsed thermography (ECPT). In this process, the extraction and subsequent separation differentiate a maximum of the thermal spatial-transient pattern between defect and non-defect areas. Specifically, a successive optical flow (OF) is established to conduct a projection of the thermal diffusion. This directly gains the benefits of capturing the thermal propagation characteristics. It enables us to build the motion context connected between the local and the global thermal spatial pattern. Principal Component Analysis (PCA) is constructed to further mine the spatial-transient patterns to enhance the detectability and sensitivity in micro crack detection. Finally, experimental studies have been conducted on an artificial crack in a steel sample and on natural fatigue cracks in aircraft brake components in order to validate the proposed method.


Publication metadata

Author(s): Wang Y, Gao B, Woo W, Tian GY, Maldague X, Zheng L, Guo Z, Zhu Y

Publication type: Article

Publication status: Published

Journal: IEEE Transactions on Industrial Informatics

Year: 2018

Volume: 14

Issue: 12

Pages: 5563-5574

Print publication date: 01/12/2018

Online publication date: 05/02/2018

Acceptance date: 02/04/2016

Date deposited: 27/02/2018

ISSN (print): 1551-3203

ISSN (electronic): 1941-0050

Publisher: IEEE

URL: https://doi.org/10.1109/TII.2018.2802046

DOI: 10.1109/TII.2018.2802046


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Funding

Funder referenceFunder name
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC
EP/K503885/1EPSRC

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