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Application of CVD-W Diffusion Barrier Layers to Dual Damascene Copper Contacts

Lookup NU author(s): Dr Alton Horsfall, Professor Anthony O'Neill

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Author(s): Wang K, Cuthbertson A, Horsfall AB, Yeoh JC, Herberholz R, O'Neill AG, Colledge S, Coulson HP, Watson D, Braithwaite G

Publication type: Conference Proceedings (inc. Abstract)

Publication status: Unknown

Conference Name: VLSI Multilevel Interconnection Conference

Year of Conference: 2007

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